Inspection of each component must be performed to confirm there are zero flaws, defects, or particles present. Every millimeter of every surface must be cleaned, treated, tested and verified before the pieces are assembled. The equipment ensures the appropriate lens quality is present to perform a chip test detecting hot, dark and dead pixels and to perform the required current, pixel response, uniformity tests and many more.
Dispensation is executed accurately and deliberately to avoid creating deformities caused by glue beading. Multiple dispensing techniques are supported including jetting and volumetric dispensing. Parameters are precisely controlled to compensate for varying glue conditions such as viscosity and repair functionalities are available should incomplete glue beading occur. Machine vision technology is used to measure the exact dispensing position and analyses the result at an early stage.
Within a clean equipment environment, alignment is performed using a fully automated multi-axis motion system. Using a variety of targets and/or projections while verifying touch-points, the components are assembled together. Testing and substantiation is performed dynamically throughout the process producing accuracy to the micrometer in accordance to NEN12233 or by Averna specific focus and alignment algorithms.
Still within the alignment environment, UV-curing of the glue is performed. This is a multi-step and real-time process as curing can shift the components from their original setting. Curing must be factored into the original measurements and tests, accounting for the continuous verification of test points throughout the assembly process. Multiple episodes of thermal curing are necessary to offer a solid structure.
The assembled product is then re-validated before it is finalized as each step may cause its own potential defect. The smallest fault within any component is quickly augmented and detrimental to the system as a whole. All verifications and tests are re-performed, regardless if the system is simple or complex, guaranteeing flawlessness and total quality. Averna’s solutions support inspection of boresight, MTF, distortion, stray light, EFL, field curvature and many more functional and end-of-line validations.
Watch our automated camera module assembly line deliver excellence in the security of a clean-room at the push of a button.
Find a semi or fully automated active alignment solution to quickly assemble camera & LiDAR modules, MEMS devices, die based sensors, LED and laser-based headlights and other high-end products with supreme accuracy. Download this brochure to discover which automated quality platform best fits your manufacturing requirements.