Automated Semiconductor Test & Measurement Solutions

Meeting the Rising Demands of a Rapidly Evolving Industry

Today’s devices must perform under tighter thermal envelopes, smaller footprints, and faster cycle times, all while staying aligned with the demands of next-gen applications, like automotive autonomy or edge AI. Test systems can no longer just confirm functionality. They must measure near the limits of timing, and keep up with shifts in materials like SiC, GaN, and MEMS.

Where Semiconductor Testing Gets More Complex

The semiconductor industry requires multi-domain test environments. Electrical and mechanical handling, optical inspection, protocol verification, all now interact within the same flow. Challenges arise from:

Maintaining sub-micron alignment in wafer handling while scaling throughput
Capturing transient electrical or optical behavior under environmental stress
Generating test coverage for MEMS, ASICs, or multi-chip modules with stimulus simulation
Meeting SEMI S2/S8/S22 requirements while optimizing cleanroom compatibility

These challenges require tailored systems, domain-specific expertise. That’s only by partnering with an engineering partner who speaks the language of modern fabs you can achieve this.

Averna’s Technical Expertise Across Semiconductor Applications

Averna delivers modular and automated test systems tailored to semiconductor production. Our platforms support critical processes such as wafer-level sorting, package testing, burn-in, I-V and C-V characterization, as well as in-system functional validation.

We engineer test environments capable of simulating real-world conditions, enabling traceable, repeatable testing across diverse wafer sizes and operating thresholds. Whether the goal is to accelerate time to market or ensure fault-proof integration, our systems meet the requirements of modern fabs and regulatory bodies alike.

These capabilities are vital across industries such as automotive, aerospace, consumer electronics, medical devices, industrial automation, and telecommunications, where chip reliability and system integration are non-negotiable.

Key Areas of Expertise

Wafer and die-level testing, with integrated burn-in environments and electro-optical inspection tools
MEMS characterization, including motion, pressure, acoustics, light, humidity, and magnetism, with physical stimulus integration
Generating test coverage for MEMS, ASICs, or multi-chip modules with stimulus simulation
IC, ASIC, and SoC full-cycle verification, with parametric analysis under temperature variation
Inline vision inspection, from PCBA solder joints to micro-assembly quality gates
Risk and standards validation, including SEMI S2/S8/S22 documentation and CE/IEC readiness
Final test stations, optimized for analog, mixed-signal, and high-speed digital components

EFEM Wafer Handling Platform

Ultra-clean automated wafer handling platform with FOUP/SMIF interface options, precision wafer alignment, and seamless robotic integration.

See our software

UniLine the Universal In-Line Tester for PCBAs

Uniline for Mixed Functional & EOL Testing

Scalable station for electrical, ICT, safety, and functional test coverage with full automation, ideal for ASIC modules and PCBA assemblies.

See the system

Active Alignment Assembly & Test Platform

See how our industry established platform can accelerate production and improve product quality. Ideal for manufacturers seeking repeatable precision assembly services at scale.

See the system

Vision Inspection Systems

Optical systems optimized for micron defect detection, bond inspection, solder paste validation, and final product classification.

See what we do

Cover - Averna Solves the Offset Problem in PCB Printing

To improve accuracy in double-sided PCB printing, Averna developed a vision-based measurement system designed to detect and correct front-to-back offset early in the production process. The solution combines high-precision optics with real-time data analysis to reduce waste and stabilize print quality.

Dual-camera architecture (fixed + movable) enabling precise measurement of PCB alignment on both sides
High-resolution optical setup with calibrated lenses ensuring consistent and repeatable metrology independent of board thickness
Integrated LabVIEW environment providing traceability, defect analysis and early error detection

This approach shifts defect detection earlier in the process, improving yield while reducing scrap and production inefficiencies.

Up to 3 µm Accuracy (X/Y)

100% Measurement Accuracy

Read Full Case Study Talk to an Expert