MEMS (Micro-Electro-Mechanical Systems) Testing Solutions

MEMS Device Testing Built for High-Volume Quality Control

microchip-mems-testing Accurate, low-cost quality control is key when MEMS devices ship in high volumes, and each part still needs individual validation and characterization. Most of that cost sits at final test, where physical stimulus is required to prove each function.

Averna Powered by Spherea designs test systems that combine physical stimulus with micron-level probing in one automated cell, so every MEMS device is characterized at production speed.

How Averna Approaches MEMS Testing

There is no need to wait for volume production. Averna steps in wherever a MEMS program needs test support, whether that means characterizing a first prototype or equipping a production line.

Phase 01
Define the test strategy

Engineers map each device function to the stimulus and measurement it requires, then set pass/fail limits with the design team.
Phase 02
Characterize in R&D

Semi-automated probing and resonant characterization validate new designs before volume, with results fed back to engineering.
Phase 03
Screen at wafer probe

Fine-pitch probing rejects defective dies before packaging, so packaging spend goes only to good parts.
Phase 04
Validate at final test

Averna’s automated test solutions apply physical stimulus under controlled temperature and sort each packaged device by result.
Phase 05
Consolidate test data

Results from every stage feed a single data flow for traceability and yield analysis.

Applications Across MEMS Markets

Microelectromechanical systems (MEMS) devices need to be tested in various industries.

Wafer probe testing and package-level semiconductor testing for inertial and pressure sensors in high-volume fabs.

Insertion loss and switching repeatability checks for MEMS-based optical devices in next-generation networks.

Tri-temperature validation that builds MEMS reliability data for ADAS and vehicle stability sensors.

Acoustic and motion characterization for MEMS microphones and IMUs in smartphones and wearables.

Environmental stress and mechanical cycling for inertial MEMS used in flight and guidance systems.

Pressure sensor characterization for medical devices, run under cleanroom conditions that protect measurement accuracy.

Technical Capabilities for MEMS Testing

Every Averna MEMS test system is designed for a specific device, so modularity is built in from the start. The capabilities below are combined to match the package and production volume of each program.

Fine-Pitch MEMS Wafer Probe Testing

Averna probing systems move multiple probes independently in X, Y and Z, reaching probing accuracy below 3 µm. Vision algorithms align probe needles to a wide variety of pad patterns. Handling accepts wafers or packaged devices, and robotized loading supports fully automated MEMS micro-probing.

Physical Stimulus and Resonant Characterization

A MEMS response only means something when it is tied to a real physical input. Averna integrates stimulus for motion, pressure, light, humidity and magnetism directly into the test cell. Parallel acquisition runs resonant characterization across many channels at once, while high-speed digitizers capture transient behavior during R&D.

MEMS Microphone Testing

Microphones need a controlled acoustic field and isolation from ambient noise. Averna builds acoustic stimulus into the test cell, so sensitivity and frequency response are measured on each device during production.

Thermal Conditioning and MEMS Reliability

Tri-temperature conditioning reproduces the operating extremes of automotive and aerospace environments. Thermal performance parameters are tracked precisely throughout each cycle. Mechanical cycling and environmental stress testing complete the picture, generating the MEMS reliability data programs need before release.

Optical MEMS and Active Alignment

For MEMS-based optical devices, Averna validates motion and position accuracy alongside electrical response. Optical switch testing covers insertion loss, return loss and cross-talk under repeated switching. Active alignment of fiber array units to photonic integrated circuits brings MEMS precision assembly and testing into a single precision process.

High-Throughput MEMS Testing Equipment

Soft-impact pick and place handles packages as small as 1 x 1 mm, including flex foils. Input and output adapt to tray, bowl feeder, wafer or tape and reel, and conversion kits support standard and custom packages. Laminar airflow keeps the test zone at ISO 14644-1 Class 5. As an NI Diamond Partner, Averna Powered by Spherea develops test software in LabVIEW and TestStand on PXI-based architectures, which shortens application development.

Proven MEMS Test Capabilities

The figures below come from MEMS test systems Averna has already designed and built. They show the level of precision the engineering team brings to every new project.

Capability	Demonstrated Performance
Probing accuracy	< 3 µm, with independent X, Y and Z motion per probe
Probe geometry	100 µm pitch, 5 µm tip size
Contact density	64 needles per probing cycle
Parallel resonant characterization	64 channels simultaneously at 400 MB/s
High-speed resonant characterization	2 GS/s sampling
Thermal conditioning	-40 °C to 150 °C, ±1 °C accuracy
Device handling	Packages down to 1 x 1 mm, leaded, leadless or flex
Input and output formats	Tray, bowl feeder or wafer input; tray, tape and reel or bulk output
Test environment	ISO 14644-1 Class 5 laminar airflow
Integrated vision	Needle-to-pad alignment, 2D/3D optical inspection, OCR and dot matrix code reading